Cerfe Labs’ first journal publication titled “Universal non-polar switching in carbon-doped transition metal oxides (TMOs) and post TMOs” is now available for free at APL materials (10, 040904 (2022) doi: 10.1063/5.0073513). We demonstrated extensive characterization of CeRAM devices including extreme temperature operation (1.5 K to 150 C) and band structure measurements to support the working of CeRAM. Our results also include array level characterization of integrated sub-50 nm CeRAM cells.
We're looking forward to presenting CeRAM at GOMACTech in March. GOMACTech, the DoD's microelectronics conference, started in 1968 and has covered some major advances over the years. Spoiler alert: we're going to update our abstract from 150 C operation to 200 C, which we've verified at two independent labs. We're in Session 18, paper 18.1
We're happy to be a contributor to this whitepaper, and we'd like to thank MITRE Engenuity for reaching out to microelectronics startup companies, to make sure that opinions from companies like ours are part of the guidance for the formation of the National Science and Technology Center (NSTC). There is a link to download the whitepaper in the article.
Cerfe Labs began disclosing very promising initial device results from our ferroelectric memory technology research work to our contacts in the commercial microelectronics world. The well-connected Peter Clarke picked up this activity for an article at eeNews Analog. This blog post adds additional background on ferroelectric memory and why we are excited about the potential of this technology.
Dr. Yeric will discuss why the world needs new memories, why materials innovation is important to this effort, and how the semiconductor industry can accelerate this effort. Additionally he will discuss Cerfe Labs' memory technologies in this light. (Title: Materials to memory: why and how)
Then Arm Fellow and now Cerfe Labs CTO Greg Yeric presented a SKY talk at this year's Design Automation title “Design and Manufacturing in 2030”. As DAC was (pre-COVID) scheduled to co-locate with SEMICON West this year, Dr. Yeric discussed technology trends that require the combined efforts of the two fields in order to progress towards 2030. He discussed molecular self-assembly and also two example projects at Arm Research: flexible substrate AI chips and Correlated Electron Memory technology.
CeRAM presented at ERI FRANC proposer’s day. Previously a Distinguished Engineer at Arm and now Cerfe Lab’s VP of Research Lu Shifren presented the CeRAM technology that was awarded research funding by DARPA’s ERI “FRANC” program (Foundations Requires for Novel Compute). CeRAM’s Multi-Level Cell (MLC) capability enabled “Beyond von Neumann” type analog neuromorphic computing, a focus of the FRANC program. https://www.darpa.mil/attachments/ERI-DAProposersDay_ConsolidatedSlides.pdf